📄 Data Privacy Policy (プライバシーポリシー)

Effective Date: 1 March 2024

1. Introduction

B2B Japan (“we,” “our,” or “us”) is committed to protecting the privacy of our clients and partners. This privacy policy outlines how we collect, use, and protect personal information across our B2B platform providing services in the automotive, employment, real estate, telecommunications (SIM cards), and education sectors in Japan.

2. Information We Collect

We may collect the following types of information:

• Business Information: Company name, address, registration number, contact details.

• Personal Information: Names, job titles, email addresses, phone numbers of contacts within businesses.

• Transaction Data: Service inquiries, quotations, contracts, payment details.

• Usage Data: Log files, browser type, access times, IP address, and cookies.

• Sensitive Information: Only when required by law or with explicit consent (e.g., for background checks or SIM registration).

3. Purpose of Data Collection

We collect and process data to:

• Provide and manage our services across industries.

• Facilitate job placements and candidate introductions.

• Enable property listings and real estate transactions.

• Assist with SIM card activations and educational service enrollments.

• Communicate with clients and manage support queries.

• Comply with Japanese laws such as the Act on the Protection of Personal Information (APPI).

4. Data Sharing and Disclosure

We do not sell or rent your personal or business information. However, we may share data with:

• Service partners and subcontractors to fulfill contract obligations.

• Legal authorities if required by Japanese law.

• International partners, only with proper safeguards (e.g., SCCs or adequacy decisions).

5. Data Storage and Security

• Data is stored on secure servers located in Japan or in accordance with Japanese data protection standards.

• We implement encryption, access control, and regular audits to ensure security.

6. Your Rights

Under Japanese law, you have the right to:

• Access, correct, or delete your personal data.

• Withdraw consent where applicable.

• File a complaint with the Personal Information Protection Commission (PPC).

📜 Terms & Conditions 

Effective Date: 1 March 2024

These Terms & Conditions (“Terms”) govern your use of the www.b2bjapan.co.jp platform  operated by B2B Japan.

1. Eligibility

This platform is intended for business use only. By using our services, you confirm you are a legally registered company or business entity in Japan or abroad.

2. Services Provided

Our website offers B2B services in the following sectors:

• Automobile: B2B listings, dealership partnerships, import/export vehicle services.

• Job Platform: Posting job offers, candidate matching, recruitment support.

• Real Estate: Commercial property listings, brokerage services.

• SIM Card Services: Corporate SIM card issuance, international roaming solutions.

• Education: Partnering with schools and universities for B2B enrollments and training.

3. User Responsibilities

• Provide accurate and lawful information.

• Use the platform only for intended B2B purposes.

• Do not engage in unlawful, misleading, or fraudulent activities.

4. Intellectual Property

All content, logos, and trademarks are the property of B2B Japan or licensed third parties. You may not reproduce, modify, or distribute them without permission.

5. Limitation of Liability

We are not liable for any indirect, incidental, or consequential damages arising from use of the platform or reliance on the information provided.

6. Termination

We reserve the right to suspend or terminate your access if you violate these Terms or applicable laws.

7. Governing Law

These Terms are governed by the laws of Japan. Any disputes shall be resolved in the Tokyo District Court.

8. Changes to These Terms

We may update these Terms periodically. Continued use of our services constitutes acceptance of any changes.

9. Contact

Mr. Sithu

admin@b2bjapan.co.jp

Tokyo , Shinjuku- KU
Hyakunincho 1-20-3
ballard Heim Watanabe Building
501